Cutting tool assembly including diamond cutting tips at half-pitch spacing for land feature creation
US7445409B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2005 |
| Grant date | Nov 4, 2008 |
| Priority date | — |
| Expiry date | May 6, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T407/27
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention is directed to a cutting tool assembly that include multiple diamonds to define multiple cutting tips. A first diamond is positioned in the cutting tool assembly to create a first groove in a microreplication tool and a second diamond is positioned in the cutting tool assembly to create a second groove the microreplication tool, wherein the first and second grooves define integer pitch spacing of a microreplication structure to be created using the microreplication tool. In addition, a third diamond is positioned in the cutting tool assembly between the first and second diamonds to create a land feature in the microreplication tool between the first and second grooves. The invention can improve land feature creation by using a third diamond tip, rather than leaving the land features untooled and defined by the original untooled surface of micro-replication tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.