Low temperature curable materials for optical applications
US7445953B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2005 |
| Grant date | Nov 4, 2008 |
| Priority date | — |
| Expiry date | Jul 24, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/0241
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to low temperature curable spin-on glass materials which are useful for electronic applications, such as optical devices. A substantially crack-free and substantially void-free silicon polymer film is produced by (a) preparing a composition comprising at least one silicon containing pre-polymer, a catalyst, and optionally water; (b) coating a substrate with the composition to form a film on the substrate, (c) crosslinking the composition by heating to produce a substantially crack-free and substantially void-free silicon polymer film, having a a transparency to light in the range of about 400 nm to about 800 nm of about 95% or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.