Phosphorus-containing cured benzoxazine resins and preparation thereof
US7446160B2 · kind B2 · utility
4Cited by
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28Claims
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Key dates
| Filing date | Apr 13, 2005 |
| Grant date | Nov 4, 2008 |
| Priority date | — |
| Expiry date | Sep 29, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4676
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A series of novel phosphorus-containing cured benzoxazine resins, which are synthesized from dihydrobenzoxazine resins with reactive phosphorus-containing compounds. The cured benzoxazine resins have desired flame retardancy and high glass transition temperature, and are suitable for the fabrication of printed circuit board and the semiconductor encapsulant applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.