Board level shielding module
US7446265B2 · kind B2 · utility
38Cited by
8References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2006 |
| Grant date | Nov 4, 2008 |
| Priority date | — |
| Expiry date | Sep 27, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for providing board level shielding of Electromagnetic Interference in a printed circuit board is disclosed. The apparatus includes a plastic part, a metal conformal coating and a form-in-place Electromagnetic Interference gasket. The plastic part is configured in one or more compartments to provide an enclosure, and is attached to the printed circuit board. The metal conformal coating is applied continuously to one or more surfaces of the plastic part. The form-in-place Electromagnetic Interference gasket is applied on top of the metal conformal coating in an area of a part flange.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.