Heat sink design using clad metal
US7446412B2 · kind B2 · utility
3Cited by
10References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 28, 2006 |
| Grant date | Nov 4, 2008 |
| Priority date | — |
| Expiry date | Mar 28, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49393
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some aspects include a heat sink base, an upper metal cladded to an upper surface of the heat sink base, the upper metal defining at least one groove, and a heat sink fin disposed in the groove and secured to the upper metal. Some aspects may also include a lower metal cladded to a lower surface of the heat sink base, and a pedestal secured to the lower cladding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.