Mirror reflective element assembly including electronic component
US7446924B2 · kind B2 · utility
251Cited by
145References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2004 |
| Grant date | Nov 4, 2008 |
| Priority date | — |
| Expiry date | Dec 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2054
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A reflective element assembly for a mirror assembly of a vehicle includes a reflective element substrate and a conductive trace or layer disposed at a rear surface of the reflective element substrate. A non-conductive layer is applied at the conductive layer and covers at least a portion of the conductive layer and leaves at least some portions of the conductive layer exposed. At least one circuitry component is applied to at least one of the portions of the conductive layer. The circuitry component may include a carbon ink resistor printed onto the conductive trace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.