Electronic component and tape head having a closure
US7446974B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2005 |
| Grant date | Nov 4, 2008 |
| Priority date | — |
| Expiry date | Jun 15, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/022
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An electronic component according to one embodiment comprises a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon, wherein the adhesive coupled to the bonding area is spaced from the closure. Additional systems and methods are also presented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.