Heat sink assembly
US7447020B2 · kind B2 · utility
19Cited by
16References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 30, 2005 |
| Grant date | Nov 4, 2008 |
| Priority date | — |
| Expiry date | Jan 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly includes a heat sink (10), a fan cover (20) mounted on the heat sink and a fan (30) carried by the fan cover. The heat sink comprises a base (12) and a plurality of spaced heat dissipation fins (140) extending from the base. The spaced heat dissipation fins define a plurality of channels (16) extending through front and rear ends of the heat sink. A cavity (40) is formed between the front end of the heat sink and the fan cover. The front end of the heat sink is configured with an arced front edge or an inclined front edge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.