Heat spreader module and method of manufacturing same
US7447032B2 · kind B2 · utility
3Cited by
28References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 5, 2006 |
| Grant date | Nov 4, 2008 |
| Priority date | — |
| Expiry date | Oct 17, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13055
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat spreader module is composed of a joined assembly, including a plate member, an insulating board disposed on the plate member, and a circuit board disposed on the insulating board. An IC chip is mounted on an upper surface of the joined assembly, or stated otherwise, on an upper surface of the circuit board, with a solder layer interposed therebetween. A heat sink is joined by a solder layer, for example, onto a lower surface of the joined assembly, or stated otherwise, onto a lower surface of the plate member, thereby making up a heat sink module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.