Heat pipe type heat dissipation device
US7448438B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 1, 2006 |
| Grant date | Nov 11, 2008 |
| Priority date | — |
| Expiry date | Sep 13, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat pipe type heat dissipation device for an electronic component comprises a base plate, a cover plate spaced from the base plate, a plurality of parallel fins extending between the base plate and the cover plate and connecting with them. The base plate, the cover plate and each two adjacent fins collectively define a unitary air passage. The base plate has a protuberant portion, which has a convex surface facing towards the cover plate and has a thickness getting small from the middle to two sides in a direction parallel to the fins. The cover plate also has a protuberant portion similar to the protuberant portion of the base plate. A heat pipe connects the protuberant portions of the cover plate and the base plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.