Multilayer printed circuit board for high-speed differential signal, communication apparatus, and data storage apparatus
US7448880B2 · kind B2 · utility
39Cited by
4References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 20, 2006 |
| Grant date | Nov 11, 2008 |
| Priority date | — |
| Expiry date | Jun 6, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09236
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In the case where high speed differential signals are transmitted in differential transmission lines through via holes with open-stubs, signal waveforms are distorted due to impedance mismatch in the open-stubs of the via holes, thus causing jitter, which has become an issue of high speed signals. For differential transmission lines that pass through via holes with open-stubs, a degree of coupling of the lines is decreased while the differential characteristic impedance is made constant. Thereby, the effects of backward cross talk noise caused by the coupling can be minimized, and thus jitter can be suppressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.