Wafer electroplating apparatus
US7449091B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2005 |
| Grant date | Nov 11, 2008 |
| Priority date | — |
| Expiry date | May 16, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A wafer electroplating apparatus with a function of bubble removal includes an electroplating bath main body and a fixing device. The electroplating bath main body has an inlet device, a first de-bubble tank and at least an air hole. The fixing device has a second de-bubble tank and an outer shell. The air hole guides gathering bubbles to an outside of the electroplating bath main body so as to remove bubbles. The fixing device can be put into the first de-bubble tank within the electroplating bath main body to form a de-bubble area and is separated easily therefrom to clean the wafer electroplating apparatus. The electroplating bath main body further includes a baffle for rectifying electroplating solution flow before entering the inlet device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.