Coating film-forming method
US7449095B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2004 |
| Grant date | Nov 11, 2008 |
| Priority date | — |
| Expiry date | Nov 10, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D5/4492
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A coating film-forming method, which method comprises coating a cationic electrodeposition coating composition onto a substrate, followed by heat curing to form a cured electrodeposition coating film, said cationic electrodeposition coating composition containing a base resin consisting of an amine-added epoxy resin (A) obtained by reacting an epoxy resin (a1) with at least one modifying agent selected from the group consisting of a polyhydric polyol (a2), an epoxy compound (a3) of the polyhydric polyol and a cyclic ester compound (a4), a polyphenol compound (a5) and an amino group-containing compound (a6), and a curing agent consisting of a blocked polyisocyanate curing agent (B) obtained by reacting at least one polyisocyanate compound (b1) selected from the group consisting of an aromatic polyisocyanate compound and an alicyclic polyisocyanate compound with at least one blocking agent (b2) selected from the group consisting of an oxime compound, aliphatic alcohols, aromatic alkyl alcohols and ether alcohols.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.