Method for producing bumps on an electrical component
US7449405B2 · kind B2 · utility
3Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2005 |
| Grant date | Nov 11, 2008 |
| Priority date | — |
| Expiry date | Mar 25, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/063
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing contacts in the form of bumps on a component that comprises a base body includes, first, positioning a template on the base body. Through holes are produced through the template. By filling the through holes with an electrically conductive material and subsequently hardening, fillers are produced. Bumps for the external electrical contact of the fillers are, then, produced directly on the surfaces of the fillers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.