Patent · US Expired

Polyoxymethylene molding compounds

US7449512B2 · kind B2 · utility

0Cited by

4References

20Claims

0Family size

Assignee

BASF SE

Inventors

Wolfgang Sauerer · Birkenheide, DE
Johannes Heinemann · Vilvoorde, BE

Key dates

Filing date	Apr 24, 2004
Grant date	Nov 11, 2008
Priority date	—
Expiry date	Jan 26, 2025

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L23/12
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Thermoplastic molding compositions, comprising

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.