Curing resin, method for producing same and curing resin composition
US7449519B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2004 |
| Grant date | Nov 11, 2008 |
| Priority date | — |
| Expiry date | Jul 11, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G65/336
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An object of the present invention is to provide a curable resin having a silyl group at the terminal that is also moisture-hardening resin which has lower in viscosity when it is used and provides superior adhesiveness when it is utilized for adhesive, sealant, and paint. The object of the invention could be achieved by a curable resin that has silicon atom-containing groups having a silicon atom bound to one or more hydrolysable groups such as alkoxy groups, acetoxy groups and oxim groups at the ends of the molecule, thioether and hydroxyl groups in the molecule, and a polymer having a polyoxyalkylene, (meth)acrylic ester, or hydrocarbon polymer as the main chain skeleton.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.