Laser processing machine
US7449659B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 28, 2005 |
| Grant date | Nov 11, 2008 |
| Priority date | — |
| Expiry date | Nov 7, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/1476
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing machine includes a beam splitter for splitting an incoming laser beam into a first laser beam having a first intensity and a second laser beam having a second intensity, a first focusing mirror for focusing the first laser beam onto a first laser processing site on a workpiece at an angle from a direction directly above the workpiece, a second focusing mirror for focusing the second laser beam onto second laser processing site on the workpiece at an angle from a direction directly above the workpiece, and a supplementary laser processing element for supplementing laser processing of the workpiece, wherein the supplementary laser processing element is disposed directly above the first or second laser processing site.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.