Composite head-electrical conditioner assembly
US7450342B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2005 |
| Grant date | Nov 11, 2008 |
| Priority date | — |
| Expiry date | Jun 10, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/484
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composite head-electrical conditioner assembly that includes a slider with a transducer head and transducer bond pads. The transducer bond pads communicate a transducer level electrical signal with the transducer head. An integrated circuit substrate has a conditioning circuit and first substrate bond pads electrically connected to the transducer bond pads. The integrated circuit substrate has second substrate bond pads with a conditioned electrical signal that is transmittable over a circuit. The slider is rigidly mounted to the integrated circuit substrate to form an assembly that is flexibly mountable. A thermal isolation space is provided between the transducer and the conditioning circuit. The integrated circuit can be in the form of a cap that provides windage reduction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.