Thermal management apparatus and method for printed circuit boards
US7450381B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2006 |
| Grant date | Nov 11, 2008 |
| Priority date | — |
| Expiry date | Mar 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20154
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus, system, and method for managing cooling within a printed circuit board (PCB) enclosure. The system includes a PCB having a first surface on which electronic components are mounted. Multiple contour control actuators are fixedly disposed in a substantially planar array in z-axis opposition to the first surface of the PCB. Each of the contour control actuators has an extensible end that is electromechanically extendable in parallel with the z-axis normal to the first surface of the PCB. A substantially flexible sheet member is disposed between the extensible ends of the contour control actuators and the first surface of the PCB. The extensible ends contact the flexible sheet member such that the z-axis contour of the flexible sheet member is determined by the z-axis positions of the extensible ends. A contour controller adjusts the z-axis contour of the flexible sheet member by adjusting the relative positions of the extensible ends of one or more of the contour control actuators. The contour controller adjusts the relative positions of the extensible ends in accordance with thermal conditions proximate to the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.