Temperature determination and communication for multiple devices of a memory module
US7450456B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2007 |
| Grant date | Nov 11, 2008 |
| Priority date | — |
| Expiry date | May 10, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C7/1051
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The temperature for multiple devices of a memory module are determined. In one example a memory module includes a printed circuit board, a plurality of memory chips on the printed circuit board, each chip containing a plurality of memory cells and a thermal sensor, and a multiplexer on the printed circuit board, independent of the memory chips, coupled to each of the thermal sensors. A current source is coupled to the multiplexer to provide a current to each one of the thermal sensors, and a voltage detector is coupled to the multiplexer to detect a voltage from each of the thermal sensors when a current is applied. A temperature circuit is coupled to the voltage detector to determine a temperature for each memory chip based on the detected voltage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.