Modular sensor assembly and methods of fabricating the same

US7451651B2 · kind B2 · utility

Assignee

• General Electric Company · US

Inventors

• Charles G. Woychik · San Jose, US
• Rayette Ann Fisher · Schenectady, US
• David Martin Mills · Niskayuna, US
• Scott D. Cogan · Clifton Park, US
• David Richard Esler · Gloversville, US
• Robert Gideon Wodnicki · Schenectady, US
• Jeffrey Scott Erlbaum · Albany, US

Key dates

• Filing date: Dec 11, 2006
• Grant date: Nov 18, 2008
• Expiry date: Dec 11, 2026

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49007
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.