Digital application of protective soldermask to printed circuit boards
US7451699B2 · kind B2 · utility
1Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2003 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Mar 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1509
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for applying ink, according to a soldermask pattern, to a printed circuit board having elevated pads defining pad edges, the method including flooding the printed circuit board with ink such that the ink advances to the pad edges and is stopped thereby and thereat, without climbing onto the elevated pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.