Micromechanical thermal-conductivity sensor having a porous cover
US7452126B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2002 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Jan 12, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/18
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromechanical thermal-conductivity sensor is provided which includes a thermally insulated diaphragm formed by a recess in a base plate exhibiting poor thermal conductivity. At least one heating element is applied on the diaphragm, at least one temperature-dependent electrical resistor is applied on the diaphragm for measuring the temperature of the diaphragm, as well as at least one further temperature-dependent electrical resistor is applied outside of the diaphragm on the base plate for measuring the ambient temperature. On one or both of its sides, the diaphragm is covered by a porous cover plate permitting gas exchange by diffusion, a cavity being left open between the diaphragm and the porous cover plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.