Protective sealing of optoelectronic modules
US7452140B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2003 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Jan 20, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and structures for protectively enclosing and sealing optoelectronic modules having emitter or detector diode arrays aligned with optical fiber facets in optoelectronic transmitters and receivers. A non-hermetic enclosure provides mechanical protection of the components during alignment and assembly of the module. A substantially hermetic enclosure provides additional protection of optoelectronic components against airborne contaminants or moisture. The protective enclosures physically encompass the diode array chip with its delicate wire bonds and also provide a liquid containment dam for easier application of resin for protective encapsulation of the diode array chip. Dual resin encapsulation may include a first resin layer chosen for transparency and a harder setting covering layer. These protective variants can be implemented in different combinations offering varying degrees of protection of the optical components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.