Molding-system platen
US7452495B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2006 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Feb 7, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/1744
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a molding-system platen, comprising a mold-support face being configured to support a mold, the mold-support face including a frustum-shaped structure having a pedestal, the pedestal being centrally positioned relative to the mold-support face, and the pedestal being offset rearward of the mold-support face, and the pedestal defining a force-receiving face being offset rearward from the mold-support face, and the force-receiving face being smaller than the mold-support face; a border surrounding the mold-support face, and a width of the border extending from an outer edge of the mold-support face toward the outer edge of the force-receiving face; an upstanding wall extending posterior of the mold-support face; and a peripheral wall extending around a periphery of the mold-support face; and a canopy linking to, and stiffening, the mold-support face and the border, the canopy being suspended over and covering, at least in part, a posterior of the mold-support face, and the canopy being positioned between the mold-support face and the force-receiving face, the canopy being attached to the upstanding wall, and the upstanding wall linking the canopy to the mold-support face…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.