Organic aluminum precursor and method of manufacturing a metal wiring using the same
US7452569B2 · kind B2 · utility
1Cited by
1References
7Claims
0Family size
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Key dates
| Filing date | Sep 21, 2006 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Oct 28, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/20
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
In a method of manufacturing a metal wiring, an organic aluminum precursor that includes aluminum as a central metal is applied to a substrate. The organic aluminum precursor applied to the substrate is thermally decomposed to form aluminum. The aluminum is deposited on the substrate to form an aluminum wiring having a low resistance. The organic aluminum precursor includes a chemical structure in accordance with one of the chemical formulae:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.