Method of sealing semiconductor element mounted on gold-plated printed circuit board
US7452571B2 · kind B2 · utility
2Cited by
3References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2006 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Feb 13, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of sealing a semiconductor element are provided. The methods includes the steps of coating a semiconductor element mounted on a gold-plated printed circuit board with a curable silicone resin, and then curing the curable silicone resin. In a method, the gold-plated printed circuit board is subjected to preliminary treatment with a treatment agent including an acid anhydride group-containing alkoxysilane and/or a partial hydrolysis-condensation product thereof In another method, the curable silicone resin includes the treatment agent. The methods yield favorable adhesion upon sealing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.