Solder deposition method and solder bump forming method
US7452797B2 · kind B2 · utility
12Cited by
14References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2004 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Jan 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1163
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a solder deposition method that includes the step of forming a dam around an electrode on a substrate, the step of applying a solder precipitating composition to the substrate, and the step of depositing solder on the surface of the electrode while heating the solder precipitating composition applied. This solder deposition method is suitable for forming large bumps at fine pitches. In particular, it is capable of depositing solder in a desired height precisely and easily, and yet preventing occurrence of voids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.