Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom
US7452920B2 · kind B2 · utility
9Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2005 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Jul 29, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/24
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrically and ionically conductive porous material including a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material. The thermoplastic binder immobilizes the moieties with respect to each other but does not substantially coat the moieties and forms the electrically conductive porous material. A wafer of the material and a method of making the material and wafer are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.