Anisotropic conductive adhesive
US7452923B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2004 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Nov 19, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0133
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention discloses an anisotropic conductive adhesive comprising an insulating adhesive component and a number of conductive particles dispersed in the insulating adhesive component, wherein the insulating adhesive component contains a crosslinked rubber resin. The anisotropic conductive adhesive of the present invention prevents exfoliation of an adhesive or reduction in adhesive strength of circuit by minimizing its the heat-contraction occurring in the process of a polymerization or a hardening reaction when connecting micro-circuits, whereby a short circuit between adjacent electrodes can be prevented when connecting the circuits, and excellent connection reliability according to a long-term use is achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.