Adhesive compounds of butyl-type rubber
US7452936B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2003 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Oct 2, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2423/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a substantially gel-free sealant or adhesive compound comprising butyl-type polymer without any conjugated aliphatic diene in its composition having an average molecular weight Mn of more than 20,000 g/mol and containing less than 15 wt. % of solid matter insoluble in boiling cyclohexane under reflux for 60 min., and a self-supporting shaped article comprising said compound optionally layered on or interposed between one or more supporting means as well as a tape comprising said substantially gel-free compound optionally layered on or interposed between one or more supporting means. In still another of its aspects, the present invention relates to an adhesive composition comprising said substantially gel-free compound. In still another of its aspects, the present invention relates to a sealant composition comprising said substantially gel-free compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.