Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof
US7453045B2 · kind B2 · utility
5Cited by
2References
6Claims
0Family size
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Key dates
| Filing date | May 25, 2006 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | May 25, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are a rigid-flexible PCB and a method for fabricating the rigid-flexible PCB. Characterized by using a liquid crystalline polymer for the formation of coverlay over flexible regions, the all-layer processing method has the advantage of preventing interlayer delamination, thereby providing a highly reliable rigid-flexible PCB which thus meets the recent requirements of electric appliances for low energy consumption, high frequency adoption, and slimness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.