Circuit device
US7453153B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2006 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Nov 11, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The ground noise is reduced which propagates between circuit elements in a circuit device having a multiple stack structure. A grounding bonding pad provided on the surface of a second circuit element is connected to a bonding wire provided on the surface of a conduction layer via a grounding wire such as gold. A bonding pad provided on the surface of the conductive layer is connected to a lead provided on a ground wire via a grounding wire such as gold. This structure creates a capacitance between the second circuit element and the conduction layer so as to prevent the propagation of noise circuit from element to the ground wiring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.