Optical coupling structure
US7454102B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2006 |
| Grant date | Nov 18, 2008 |
| Priority date | — |
| Expiry date | Apr 26, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4204
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optoelectronic coupling structure, a method of manufacture, and a method of operation are described. The optical coupling structure includes a waveguide that is formed within a device layer of an SOI substrate. A prism is located on a bottom side of the SOI substrate. A BOX layer of the SOI substrate, which is interposed between the prism and the waveguide, serves as a spacer region, which promotes an optical coupling of the prism to the waveguide. By positioning the prism below the waveguide, an optoelectronic IC may more readily accommodate a prism. The prism may be directly fabricated in a bulk layer of the SOI substrate or directly bonded to a bottom side surface of the BOX layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.