System and method of measuring and mapping three dimensional structures
US7455407B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2004 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Oct 8, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01M11/0257
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for mapping a three-dimensional structure includes a projecting optical system adapted to project light onto an object, a correction system adapted to compensate the light for at least one aberration in the object, an imaging system adapted to collect light scattered by the object and a wavefront sensor adapted to receive the light collected by the imaging system and to sense a wavefront of the received light. For highly aberrated structures, a number of wavefront measurements are made which are valid over different portions of the structure, and the valid wavefront data is stitched together to yield a characterization of the total structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.