High density array of optical transceiver modules
US7455463B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2005 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Jan 27, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4246
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments of the present invention are directed to high density arrays of optical transceiver modules. A first fabricated package includes a light source and/or light detector, a first surface with at least one opening for transferring optical signals, and a second opposing surface. A second fabricated package has an opening for accepting a component insert and is oriented such that the length of the second fabricated package is essentially perpendicular to the second opposing surface. A lead frame mechanically connects the first fabricated package and the second fabricated package and electrically connects the light source and/or light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts such that components of the component insert can electrically interoperate with the light source and/or light detector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.