Semiconductor device with power module and an insulating member provided between a conductive casing and a non-insulating portion
US7455553B2 · kind B2 · utility
0Cited by
7References
8Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 9, 2006 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Apr 19, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrically insulating member is provided between a bus bar of an IPM and a nearby casing so as to electrically insulate the casing from the bus bar of the IPM. Above the portion where electrical insulation is necessary, a bracket provided for supporting a component-to-be supported is secured to the casing. The electrically insulating member is attached to a lower portion of the bracket that is an existing component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.