Method and apparatus for forming a coating
US7455892B2 · kind B2 · utility
57Cited by
27References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2001 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Nov 12, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H2240/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for forming a coating on a substrate using an atmospheric pressure plasma discharge. The method comprises introducing an atomized liquid and/or solid coating-forming material into an atmospheric pressure plasma discharge and/or an ionized gas stream resulting therefrom, and exposing the substrate to the atomized coating-forming material. The application also described a method for polymerizing a polymer forming material, and further to apparatus for forming a coating on a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.