Photosensitive resin composition
US7455948B2 · kind B2 · utility
3Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2005 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Sep 11, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/38
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
This invention relates to a positive photosensitive resin composition allowing development with an alkaline aqueous solution and excellent in resolution, photosensitivity and pattern form even if the film formed from the resin is thick.Furthermore, this invention relates to a photosensitive resin composition comprising (a) a polymer having one or more phenolic hydroxyl groups, (b) a compound having a phenolic hydroxyl group and containing only one group selected from a methylol group and alkoxymethyl group, and (c) a photo acid generator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.