Polymer for heat-sensitive lithographic printing plate precursor
US7455949B2 · kind B2 · utility
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25References
9Claims
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Key dates
| Filing date | Sep 25, 2003 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Sep 12, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41C2210/262
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polymer for a heat-sensitive lithographic printing plate precursor is disclosed wherein the polymer comprises a phenolic monomeric unit of which the phenyl group is substituted by a group A characterised in that the group A comprises an imide or thioimide group and wherein the modification of the polymer increases the chemical resistance of the coating of the printing plate precursor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.