Thermal intermediate apparatus, systems, and methods
US7456052B2 · kind B2 · utility
9Cited by
16References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2003 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Jul 18, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached thereto to tether the nanotubes to at least one of a die and a heat sink. The organic moieties include thiol linkers and amide linkers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.