Method of using a setter having a recess in manufacturing a net-shape semiconductor wafer
US7456084B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2005 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Jan 27, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/958
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is provided a method of fabricating a wafer, comprising depositing semiconductor material into a recess in a setter, moving the setter through a heating/cooling region to subject the semiconductor material to a temperature profile, and removing a wafer from the recess. The size and shape of the wafer are substantially equal to the size of the wafer when it is used. As a result, the wafer can be fabricated in any desired shape and with any of a variety of surface structural features and/or internal structural features. The temperature profile can be closely controlled, enabling production of wafers having structural features not previously obtainable. There are also provided wafers formed by such methods and setters for use in such methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.