Using a thru-hole via to improve circuit density in a PCB
US7456364B2 · kind B2 · utility
2Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2006 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Nov 28, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes multiple layers on which electrically conductive traces reside, where at least two of the electrically conductive traces each has a first portion formed on one layer of the printed circuit board and a second portion formed on another layer of the printed circuit board. The printed circuit board also includes a thru-hole via that includes at least two electrically conductive portions electrically isolated from each other, such that each of the electrically conductive portions connects electrically to both the first and second portions of a corresponding one of the electrically conductive traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.