Semiconductor device, manufacturing method of semiconductor device and module for optical device
US7456483B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2005 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Jun 7, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16235
Abstract
A bond portion for bonding the principal plane of a solid-state imaging element with a transparent covering portion and configuring a hollow portion therebetween is provided with: a first opening end portion on the hollow portion side; a second opening end portion on the outer side; and a trap portion. The first opening end portion, the trap portion and the second opening end portion constitute a vent path. The vent path is shaped not to connect the first opening end portion with the second opening end portion linearly but to connect the opening end portions in the bond portion via the trap portion larger than the opening end portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.