Electronic devices and its production methods
US7456497B2 · kind B2 · utility
85Cited by
7References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 14, 2003 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Dec 13, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device having mounted thereon an MEMS element or other functional elements, in which a device body and lid define an element-carrying space, the element-carrying space is sealed air-tight by an ultrasonic bonded part bonding the device body and the lid, and the element-carrying space having arranged inside it a system element secured to the device body and/or the lid by flip-chip connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.