Radio frequency identification (RFID) tag lamination process using liner
US7456506B2 · kind B2 · utility
5Cited by
25References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 22, 2005 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Jan 20, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P80/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.