Chassis mounted heat sink system
US7457123B1 · kind B1 · utility
11Cited by
27References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 10, 2007 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | May 29, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20418
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink for an electronics enclosure is disclosed. The heat sink comprises a thermal conduction section with an inner surface and an outer surface, the thermal conduction section having an extended profile that tapers from a first end having a first thickness to a second end having a second thickness that is larger than the first thickness. A mounting plate is contiguous with the second end, and the mounting plate is configured to couple the heat sink to a chassis of the electronics enclosure. A thermal interface pad is coupled to the outer surface of the thermal conduction section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.