Via stub termination structures and methods for making same
US7457132B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2005 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Nov 12, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Vias are used in multilayer printed circuit boards to route electrical interconnects between layers. Some via constructions embodiments result in the formation of a via-stub section. Via stub sections can distort signals passing through the interconnect and decrease the usable bandwidth of the interconnect. To minimize distortion and increase bandwidth, one or more terminating elements can be attached to the unterminated end of the via-stub section. The impedance terminating element may include, by way of non-limiting example, one or more resistors, capacitors, and/or inductors between the via stub and a ground layer. The impedance terminating element may be formed internally to the PCB or mounted to the PCB surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.