Semiconductor laser diode package
US7457334B2 · kind B2 · utility
2Cited by
8References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 13, 2005 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Jan 13, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/1039
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided is a semiconductor laser diode package. The semiconductor laser diode package may include: a stem having a through hole formed at a predetermined position; a heat sink that may be disposed around the through hole and projects from one side of the stem; and a semiconductor laser diode mounted onto the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.