Method and apparatus for normalizing thermal gradients over semiconductor chip designs
US7458052B1 · kind B1 · utility
2Cited by
28References
17Claims
0Family size
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Key dates
| Filing date | Aug 29, 2005 |
| Grant date | Nov 25, 2008 |
| Priority date | — |
| Expiry date | Feb 22, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/367
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for normalizing thermal gradients over semiconductor chip designs is provided. One embodiment of a novel method for normalizing an expected thermal gradient includes determining a location of the thermal gradient in the semiconductor chip design and inserting at least one supplemental heat source into the semiconductor chip design such that the thermal gradient is normalized by heat dissipated by the supplemental heat source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.